Author:
Clech J.-P.M.,Langerman F.M.,Augis J.A.
Cited by
7 articles.
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1. Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
2. Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
3. Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime;Journal of Materials Science: Materials in Electronics;2016-11-09
4. Reliability physics behind the QFN state of stress;Journal of Materials Science: Materials in Electronics;2016-10-26
5. Probabilistic Palmgren–Miner rule, with application to solder materials experiencing elastic deformations;Journal of Materials Science: Materials in Electronics;2016-10-22