Funder
Universiti Putra Malaysia
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference45 articles.
1. T.T. Dele-Afolabi, M.A. Hanim, M. Norkhairunnisa, H.M. Yusoff, M.T. Suraya, Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes. J. Alloys Compd. 649, 368–374 (2015)
2. K.M. Kumar, V. Kripesh, A.A. Tay, Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders. J. Alloys Compd. 450(1–2), 229–237 (2008)
3. T.T. Dele-Afolabi, M.A. Hanim, M. Norkhairunnisa, M.T. Suraya, H.M. Yusoff, Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint, vol. 238, in IOP Conference Series: Materials Science and Engineering (IOP Publishing, Bristol, 2017). p. 012010
4. T. Wang, P. Zhou, F. Cao, H. Kang, Z. Chen, Y. Fu, Q. Yuan, Growth behavior of Cu6Sn5 in Sn–6.5 Cu solders under DC considering trace Al: in situ observation. Intermetallics 58, 84–90 (2015)
5. M.S. Gumaan, R.M. Shalaby, E.A.M. Ali, M. Kamal, Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy. J. Mater. Sci.: Mater. Electron. 29(11), 8886–8894 (2018)
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