Formation and characterization of intermetallic compounds in electroplated cobalt

Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

Published:2018-01-17 Issue:7 Volume:29 Page:5791-5798
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Goh Yingxin,Goh Yi Sing,Lee Ee Lynn,Ong Meng Teck,Haseeb A. S. M. A.

Funder

University of Malaya High Impact Research Grant

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s10854-018-8550-1/fulltext.html

Reference27 articles.

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3. K. Ruhmer, E. Laine, K. Hauck, D. Manessis, A. Ostmann, M. Toepper, in Proceedings of International Symposium on High Density Packaging and Microsystem Integration, 2007, HDP’07, 2007

4. S.Y. Jang, K.W. Paik, J. Wolf, H. Reichl, H. Gloor, Adv. Electron. Mater. Packag. 2001, 121–128 (2001)

5. C. Wang, C. Kuo, S. Huang, P. Li, Intermetallics 32, 57–63 (2013)

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