The influence of current density and bath temperature on electrodeposition of rhodium film from sulfate–phosphate aqueous solutions-Reference-Cited by-同舟云学术

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The influence of current density and bath temperature on electrodeposition of rhodium film from sulfate–phosphate aqueous solutions

Published:2019-08-30 Issue:10 Volume:49 Page:1043-1054
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Wu Wangping^ORCID,Liu Jianwen,Zhang Yue,Wang Xiang,Zhang Yi

Funder

National Natural Science Foundation of China

Funding of Changzhou high technology research key laboratory of mould advanced manufacturing

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s10800-019-01348-5.pdf

Reference42 articles.

1. Weisberg AM (1999) Rhodium plating. Met Finish 97(1):297–301. https://doi.org/10.1016/S0026-0576(00)80337-2

2. Fink CG, Lambros GC (1933) Rhodium plating. Trans Electrochem Soc 63(1):181–186. https://doi.org/10.1149/1.3493809

3. Son SH, Lee HK, Park SC (2010) Kinetics of rhodium electrodeposition for semiconductor interconnect applications. Surf Interface Anal 42(6–7):1244–1246. https://doi.org/10.1002/sia.3288

4. Pushpavanam M, Raman V, Shenoi BA (1981) Rhodium-electrodeposition and applications. Surf Technol 12(4):351–360. https://doi.org/10.1016/0376-4583(81)90029-7

5. Angus HC (1965) Electrodeposition of rhodium and ruthenium for slip-ring surfaces. Trans IMF 43(1):135–142. https://doi.org/10.1080/00202967.1965.11869966

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