Author:
Son Seong-Ho,Lee Hong-Kee,Park Sung-Cheol
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference8 articles.
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2. Damascene copper electroplating for chip interconnections
3. I. Shao J. M. Cotte B. Haran A. W. Topol E. E. Simonyi C. Cabral H. Deligianni IEEE 2007 International Interconnect Technology Conference 2007 102
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3 articles.
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