Effect of electrodeposited Cu interlayer thickness on characterizations and adhesion force of Ni/Cu/Ni coatings on polyetherimide composite substrates-Reference-Cited by-同舟云学术

Effect of electrodeposited Cu interlayer thickness on characterizations and adhesion force of Ni/Cu/Ni coatings on polyetherimide composite substrates

Published:2024-02 Issue: Volume:129 Page:103580
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Xie Dingkai,Wu Wangping,Huang Jiaqi,Wang Xiang,Zhang Yi,Wang Zhizhi,Jiang Peng,Tang Lixin,Wu Fulong,Wang Qinqin

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference65 articles.

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4. Effect of plating temperature on electroless amorphous Ni–P film on Si wafers in an alkaline bath solution;Wu;Appl Nanosci,2017

5. Metallized plastics 1: fundamental and applied aspects;Mittal,1989

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