An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy-Reference-Cited by-同舟云学术

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An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy

Published:2007-12-11 Issue:4 Volume:38 Page:457-468
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Gabrielli C.,Moçotéguy P.,Perrot H.,Nieto-Sanz D.,Zdunek A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s10800-007-9459-1.pdf

Reference20 articles.

1. Moffat TP, Wheeler D, Huber WH, Josell D (2001) Electrochem Solid State Lett 4:C26

2. Koh LT, You GZ, Lim SY, Lim CY, Foo PD (2001) Microelectronics J 32:973

3. Epelboin I, Lenoir F, Wiart R (1972) J Cryst Growth 13:417

4. Burrows IR, Harrison JA, Thomson J (1975) J Electroanal Chem 58:241

5. Razumney G, O’M Bockris J (1973) J Electroanal Chem 46:185

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