Rapid screening of plating additives for bottom-up metallization of nano-scale features
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrochemistry,General Chemical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s10800-015-0873-5.pdf
Reference26 articles.
1. Andricacos PC, Uzoh C, Dukovic JO, Horkans J, Deligianni H (1998) Damascene copper electroplating for chip interconnections. IBM J Res Dev 42:567–574
2. Healy JP, Pletcher D, Goodenough M (1992) The chemistry of the additives in an acid copper electroplating bath. 1. Polyethylene-glycol and chloride-ion. J Electroanal Chem 338:155–165
3. Kelly JJ, West AC (1998) Copper deposition in the presence of polyethylene glycol—I. Quartz crystal microbalance study. J Electrochem Soc 145:3472–3476
4. Kelly JJ, West AC (1998) Copper deposition in the presence of polyethylene glycol—II. Electrochemical impedance spectroscopy. J Electrochem Soc 145:3477–3481
5. Feng ZV, Li X, Gewirth AA (2003) Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths: a surface-enhanced Raman study. J Phys Chem B 107:9415–9423
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