Role of Macro- and Microdistribution in the Formation of Metal and Alloy Layers in the Production of Printed Circuits and Other Components of Electronic Devices-Reference-Cited by-同舟云学术

Role of Macro- and Microdistribution in the Formation of Metal and Alloy Layers in the Production of Printed Circuits and Other Components of Electronic Devices

Published:2018-11 Issue:6 Volume:52 Page:975-986
ISSN:0040-5795
Container-title:Theoretical Foundations of Chemical Engineering
language:en
Short-container-title:Theor Found Chem Eng

Author:

Kruglikov S. S.,Kolesnikov V. A.,Nekrasova N. E.,Gubin A. F.

Publisher

Pleiades Publishing Ltd

Subject

General Chemical Engineering,General Chemistry

Link

http://link.springer.com/article/10.1134/S0040579518060064/fulltext.html

Reference55 articles.

1. Landolt, D., Electrodeposition science and technology in the last quarter of the twentieth century, J. Electrochem. Soc., 2002, vol. 149, no. 3, pp. S9–S20. https://doi.org/10.1149/1.1469028

2. Schultze, J.W. and Bressel, A., Principles of electrochemical micro- and nano-system technologies, Electrochim. Acta, 2001, vol. 47, nos. 1–2, pp. 3–21. https://doi.org/10.1016/S0013-4686(01)00584-9

3. Honma, H., Plating technology for electronics packaging, Electrochim. Acta, 2001, vol. 47, nos. 1–2, pp. 75–84. https://doi.org/10.1016/S0013-4686(01)00591-6

4. Datta, M. and Landolt, D., Fundamental aspects and applications of electrochemical microfabrication, Electrochim. Acta, 2000, vol. 45, nos. 15–16, pp. 2535–2558. https://doi.org/10.1016/S0013-4686(00)00350-9

5. Kobayashi, T., Kawasaki, J., Mihara, K., and Honma, H., Via-filling using electroplating for build-up PCBs, Electrochim. Acta, 2001, vol. 47, nos. 1–2, pp. 85–89. https://doi.org/10.1016/S0013-4686(01)00592-8

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The impact of current reversal in the presence of inhibitory additives on the thermomechanical stability of galvanic copper coatings;International Journal of Corrosion and Scale Inhibition;2022-09-22

2. Analyzing the Conditions for the Electrolytic Formation of Ensembles from Metal Nanowires in the Pores of Track Membranes;Theoretical Foundations of Chemical Engineering;2021-09

3. Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB;Journal of Solid State Electrochemistry;2021-03-04

4. Effect of the inhibiting action of additives on the macro- and microdistribution of copper during electrodeposition from sulfuric acid electrolytes;International Journal of Corrosion and Scale Inhibition;2020-09-26

5. On the Mechanism of the Quasi-Potentiostatic Mode in the Template Electrochemical Synthesis of Nanowires;Theoretical Foundations of Chemical Engineering;2019-11