The creep and strain rate sensitivity of a high Pb content solder with comparisons to 60Sn/40Pb solder

Author:

Solomon Harvey D.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference117 articles.

1. J. H. Lau and D. W. Rice, Solid State Techn.28, 91 (1985).

2. H. D. Solomon, “Review of Critical Variables Determining Solder Fatigue Lives” presented at the Spring 1989 MRS meeting April 28, 1989, to be published by the Mater. Res. Soc., 1989.

3. R. N. Wild, Welding J.51, 521s (1972).

4. R. N. Wild, Internepcon, Oct. 1975 (IBM# 74Z000481).

5. D. M. Jarboe, “Thermal Fatigue of Solder Alloys,” NTIS-BDX-613-2341, 1980.

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