Stress–strain characteristics of tin-based solder alloys at medium strain rate-Reference-Cited by-同舟云学术

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Stress–strain characteristics of tin-based solder alloys at medium strain rate

Published:2008-06 Issue:17-18 Volume:62 Page:3031-3034
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Wong E.H.,Selvanayagam C.S.,Seah S.K.W.,van Driel W.D.,Caers J.F.J.M.,Zhao X.J.,Owens N.,Tan L.C.,Frear D.R.,Leoni M.,Lai Y.-S.,Yeh C.-L.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

2. Strain-rate and temperature-dependent stress-strain curves of Sn-Pb eutectic alloy

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method;Journal of Electronic Packaging;2023-11-10

3. Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Undoped and Doped Solder Performance under High Strain Rates and Wide Operating Temperatures after Prolonged Storage;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

5. Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics;Materials Science and Engineering: A;2022-10

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