Effect of Co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate
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Publisher
International Association Welding
Reference8 articles.
1. 1. Chen, X., Zhou, J., Xue, F. et al. (2015) Microstructures and mechanical properties of Sn−0.1 Ag−0.7 Cu− (Co, Ni, аnd Nd) lead-free solders. J. Electron. Mater., 44(2), 725−732.
2. Effect of Ni or Co addition to Sn−Ag solder on microstructure and joint strength at interface;Nishikawa;Mater Transact 49(7) 1518−,2008
3. Development of Sn−Ag−Cu and Sn− Ag−Cu−X alloys for Pb-free electronic solder applications;Anderson;J Mater Sci -Mater El 18(1−3) 55−,2007
4. 4. Gao, F., Takemoto, T., Nishikawa, H. (2006) Effects of Co and Ni addition on reactive diffusion between Sn−3.5Ag solder and Cu during soldering and annealing. Mater. Sci. Eng. A., 420(1−2), 39−46.
5. 5. Haseeb, A., Leng, T.S. (2011) Effects of Co nanoparticle addition to Sn−3.8Ag−0.7 Cu solder on interfacial structure after reflow and ageing. Intermetallics, 19(5), 707−712.
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