Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package.-Reference-Cited by-同舟云学术

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Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package.

Published:1994 Issue:577 Volume:60 Page:1985-1991
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

Sato Mitsuru,Yuuki Ryoji,Inoue Akio,Tani Shuichi,Yoshioka Sumio,Iwaoka Makoto

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.jstage.jst.go.jp/article/kikaia1979/60/577/60_577_1985/_pdf

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2. Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2010

3. FEM and BEM in electronic packaging A bibliography (1998–1999);Finite Elements in Analysis and Design;2001-02

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