Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites
Author:
Affiliation:
1. Advanced Technology R&D Center, Mitsubishi Electric Corporation
2. Deparment of Mechanical Engineering, Kyushu University
Publisher
Japan Society of Mechanical Engineers
Link
http://www.jstage.jst.go.jp/article/jmmp/5/10/5_10_546/_pdf
Reference15 articles.
1. Boundary element analysis of steady-state heat conduction and thermal stresses in the LSI package.
2. Boundary Element Heat Conduction and Thermoelastic Analyses of Interface Crack in LSI Package in Consideration of Contact Between Crack Surfaces.
3. Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package.
4. A study of package cracking during the reflow soldering process.
5. Strength Evaluation of Plastic Packages during Solder Reflow Process.
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