Effects of interfacial thermal resistance on surface cracking in a coating layer bonded to a substrate
Author:
Affiliation:
1. Department of Mechanical Engineering, University of Maine
2. Department of Mechanical Engineering, Shizuoka University
Publisher
Japan Society of Mechanical Engineers
Subject
General Medicine
Link
https://www.jstage.jst.go.jp/article/mel/2/0/2_16-00436/_pdf
Reference14 articles.
1. Bhatt, H., Donaldson, H. Y. and Hasselman, D. P. H., Role of the interfacial thermal barrier in the effective thermal diffusivity/conductivity of SiC-fiber-reinforced reaction-bonded silicon nitride, Journal of the American Ceramic Society, Vol. 73 (1990), pp. 312-316.
2. Blandford G. E. and Tauchert, T. R., Thermoelastic analysis of layered structures with imperfect layer contact, Computers and Structures, Vol. 21 (1985), pp. 1283-1291.
3. Carslaw, H. S. and Jaeger, J. C., Conduction of Heat in Solids, 2nd edition (1959), Oxford University Press.
4. Chen, T. C. and Jang, H. I, Thermal stresses in a multilayered anisotropic medium with interface thermal resistance, Journal of Applied Mechanics, Vol. 62 (1995), pp. 810-811.
5. Gundappa, M., Thomas, J. R. and Hasselman, D. P. H., Analysis of thermal stresses in a solid circular cylinder subjected to conductive heat transfer with thermal boundary conductance, Journal of Thermal Stresses, Vol. 8 (1985), pp. 265-276.
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