A sub-interface thermal crack problem for bonded dissimilar plates with interfacial thermal resistance
Author:
Affiliation:
1. College of Aerospace Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, Jiangsu, China;
2. Department of Mechanical Engineering, University of Maine, Orono, Maine, USA
Funder
the National Natural Science Foundation of China
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/01495739.2018.1563515
Reference18 articles.
1. Role of the Interfacial Thermal Barrier in the Effective Thermal Diffusivity/Conductivity of SiC-Fiber-Reinforced Reaction-Bonded Silicon Nitride
2. Effect of Thermal Expansion Mismatch on the Thermal Diffusivity of Glass-Ni Composites
3. Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance
4. Effective thermal conductivity of particulate composites with interfacial thermal resistance
5. Thermoelastic analysis of layered structures with imperfect layer contact
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