Thermal Fatigue Life of Solder Bumps in BGA.-Reference-Cited by-同舟云学术

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Thermal Fatigue Life of Solder Bumps in BGA.

Published:1998 Issue:2 Volume:41 Page:260-266
ISSN:1344-7912
Container-title:JSME International Journal Series A
language:en
Short-container-title:JSME Int. J., Ser. A

Author:

MUKAI Minoru,KAWAKAMI Takashi,TAKAHASHI Kuniaki,KISHIMOTO Kikuo,SHIBUYA Tosikaz

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,General Materials Science

Link

http://www.jstage.jst.go.jp/article/jsmea1997/41/2/41_2_260/_pdf

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Significance of Die Shadow Size and Placement on Solder Joint Reliability Performance;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

2. Effect of thermal cycling and vibration on cracking in Sn-3.0Ag-0.5Cu solder bump;Materials Today: Proceedings;2021-11

3. Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit;Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems;2018-05-03

4. Fatigue life of lead free solder material with very sharp notch;Recent Advances in Structural Integrity Analysis - Proceedings of the International Congress (APCF/SIF-2014);2014

5. Health-monitoring method of note PC for cooling performance degradation and load assessment;Microelectronics Reliability;2011-02

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