1. Vibration testing and analysis of ball grid array package solder joints;Wong,2007
2. M. Mukai, T. Kawakami, K. Takahashi, K. Kishimoto, and T. Shibuya, JSME Int. J., Ser. A 41 (1998) 260-266.
3. Electronics manufacturing: with lead-free, halogen-free, and conductive-adhesive materials;Lau,2003
4. Lead (Pb)-free solders for electronic packaging
5. A. Schubert, R. Dudek, E. Auerswald, A. Gollhardt, B. Michel, and H. Reichl, Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation, In: Proceedingsof 53rd electronic components and technology conference, pp. 603-610