Loss in discharging atoms through artificial hole for fabricating metallic micro/nanowire by electromigration
Author:
Affiliation:
1. Department of Finemechanics, Tohoku University
Publisher
Japan Society of Mechanical Engineers
Subject
General Medicine
Link
https://www.jstage.jst.go.jp/article/mej/6/1/6_18-00269/_pdf
Reference33 articles.
1. Barako, M.T., Roy-Panzer, S., English, T.S., Kodama, T., Asheghi, M., Kenny, T.W. and Goodson, K.E., Thermal conduction in vertically aligned copper nanowire arrays and composites, ACS Applied Materials & Interfaces, Vol. 7, No. 34 (2015), pp.19251-19259.
2. Blech, I.A., Electromigration in thin aluminum films on titanium nitride, Journal of Applied Physics, Vol. 47, No. 4 (1976), pp.1203-1208.
3. Blech, I.A. and Herring, C., Stress generation by electromigration, Applied Physics Letters, Vol. 29, No. 3 (1976), pp.131-133.
4. Cao, G. and Liu, D., Template-based synthesis of nanorod, nanowire, and nanotube arrays, Advances in Colloid and Interface Science, Vol. 136, Nos. 1-2 (2008), pp.45-64.
5. Chen, M., Yue, Y. and Ju, Y., Growth of metal and metal oxide nanowires driven by the stress-induced migration, Journal of Applied Physics, Vol. 111, (2012), 104305, 6 pages.
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1. Electromigration-Driven Crystallinity Design of Metallic Nanowire;Journal of the Society of Materials Science, Japan;2022-09-15
2. Intermetallic compound formation inhibiting electromigration-based micro/nanowire growth;Journal of Vacuum Science & Technology B;2021-12
3. Residual stress effect governing electromigration-based free-standing metallic micro/nanowire growth behavior;Applied Physics Letters;2020-01-13
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