Stabilization of MEMS accelerometer properties using stretchable beam structure
Author:
Affiliation:
1. Research and Development Group, Hitachi, Ltd.
Publisher
Japan Society of Mechanical Engineers
Link
https://www.jstage.jst.go.jp/article/transjsme/82/840/82_16-00177/_pdf
Reference19 articles.
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2. Boser, B. E. and Howe, R. T., Surface micromachined accelerometers, IEEE Journal of Solid-State Circuits, Vol. 31 (1996), pp. 366-375.
3. Cheng, Y.-T., Hsu, W.-T., Najafi, K., Nguyen, C. T.-C. and Lin, L., Vacuum packaging technology using localized aluminum/silicon-to-glass bonding, Journal of Microelectromechanical Systems, Vol. 11, No. 5 (2002), pp.556-565.
4. Felton, L. E., Duffy, M., Hablutzel, N., Farrell, P. W. and Webster, W. A., Low-cost packaging of inertial MEMS devices, Proceeding of International Symposium on Microelectronics (IMAPS) (2003), pp. 402-406.
5. Hsieh, H., Chang, H., Hu, C., Cheng, C. and Fang, W., A novel stress isolation guard ring design for the improvement of a three-axis piezoresistive accelerometer, Journal of Micromechanics and Microengineering, Vol. 21, No. 10 (2011), 105006.
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