Vacuum packaging technology using localized aluminum/silicon-to-glass bonding-Reference-Cited by-同舟云学术

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Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Published:2002-10 Issue:5 Volume:11 Page:556-565
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:en
Short-container-title:J. Microelectromech. Syst.

Author:

Cheng Y.-T.,Wan-Tai Hsu ,Najafi K.,Nguyen C.T.-C.,Liwei Lin

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx5/84/22266/01038851.pdf?arnumber=1038851

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