Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera-Reference-Cited by-同舟云学术

Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera

Published:2016 Issue:836 Volume:82 Page:15-00491-15-00491
ISSN:2187-9761
Container-title:Transactions of the JSME (in Japanese)
language:en
Short-container-title:

Author:

HIROGAKI Toshiki¹,AOYAMA Eiichi¹,OGAWA Keiji²,ONCHI Suguru³,IOZUMI Munetaka³

Affiliation:

1. Department of Mechanical Engineering, Doshisha University

2. Department of Mechanical and Systems Engineering, Ryukoku University

3. Graduate School of Doshisha University

Publisher

Japan Society of Mechanical Engineers

Link

https://www.jstage.jst.go.jp/article/transjsme/82/836/82_15-00491/_pdf

Reference10 articles.

1. Hirogaki, T., Aoyama, E., Katayama, T., Kondou, H., Ninagi, R. and Inoue, H., Quality estimation of small diameter via holes for circuit connection on multi-layer printed wiring boards using F. E. M. ,Transactions of the Japan Society of Mechanical Engineers, Series C, Vol.69, No.678 (2003), pp.509-515 (in Japanese).

2. Hirogaki, T., Aoyama, E., Ogawa, K., Onchi, S. and Obata, K., Elucidation of process mechanisms of Cu-direct laser drilling in printed wiring boards based on monitoring method with a high speed camera, Transactions of the Japan Society of Mechanical Engineers, Series C, Vol.79, No.801 (2013), pp.1798-1810 (in Japanese).

3. Kanari, K., Hukugoukei no netudendouritu, koubunshi 26 (1977), p.557 (in Japanese).

4. Kataoka, K., Gokuusudouhaku wo tukattaatarashiikouhouheno challenge－koumitudotoruhosohaisenka・koukinouka no youkyuu ni kotaete, Electron. Packaging, Vol.2, No.4(2001), pp. 108-112 (in Japanese).

5. Kawaguchi, A., Motoizumi, Y., Hirai, K., Takahashi, H. and Takahama, S., Douhyoumensankamaku no kanikeisoku, The report of Kanagawa industrial technology center, No.15 (2009), pp.45-46 (in Japanese).

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1. Temperature monitoring with a high-speed camera based on two color method and its CFD analysis in Cu direct laser drilling of printed circuit board;Transactions of the JSME (in Japanese);2021

2. Estimation of monitoring image in laser blind via-hole drilling process of printed wiring boards with a high speed video camera and temperature visualization from obtained image by two-color method;Transactions of the JSME (in Japanese);2019