Temperature monitoring with a high-speed camera based on two color method and its CFD analysis in Cu direct laser drilling of printed circuit board-Reference-Cited by-同舟云学术

Temperature monitoring with a high-speed camera based on two color method and its CFD analysis in Cu direct laser drilling of printed circuit board

Published:2021 Issue:896 Volume:87 Page:20-00413-20-00413
ISSN:2187-9761
Container-title:Transactions of the JSME (in Japanese)
language:en
Short-container-title:

Author:

HIROGAKI Toshiki¹,AOYAMA Eiichi¹,YAMAGUCHI Ryouta²,NAKAGAWA Wataru²

Affiliation:

1. Department of Mechanical Engineering,Doshisha University

2. Graduate School at Doshisha University

Publisher

Japan Society of Mechanical Engineers

Link

https://www.jstage.jst.go.jp/article/transjsme/87/896/87_20-00413/_pdf

Reference25 articles.

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3. Committee of wiring board manufacturing in the Japan Institute of Electronics Packaging, Recent topics in the plating technology for printed wiring boards, Journal of the Japan institute of electronics Packaging, Vol.17, No.1 (2014), pp.15-19 (in Japanese).

4. Costello, S., Strusevich, N., Patel, M. K., Bailey, C., Flynn, D., Kay, R. W., Patel, M. K., Bailey, C., Price, D., Bennet, M., Jones, A. C. and Desmulliez, M. P. Y., Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation, Microsyst Technol, Vol. 19, Issue 6 (2013), pp.783-790.

5. Freitas, G.C.S., Peixoto, F.C. and Vianna Jr., A.S., Simulation of a thermal battery using Phoenics, Journal of Power Sources, Vol. 179, Issue 1 (2008), pp.424-429.