On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?
Author:
Affiliation:
1. University of California, Santa Cruz, CA, University of Maryland, College Park, MA, and ERS Co.
Publisher
Japan Society of Mechanical Engineers
Link
http://www.jstage.jst.go.jp/article/jmmp/3/8/3_8_990/_pdf
Reference13 articles.
1. 1. R. Zeyfang, “Stresses and Strains in a Plate Bonded to a Substrate: Semiconductor Devices”, Solid State Electronics, vol. 14, 1971
2. MIXED BOUNDARY-VALUE PROBLEMS OF STEADY-STATE THERMOELASTICITY AND ELECTROSTATICS
3. 3. W. T. Chen and C. W. Nelson, “Thermal Stresses in Bonded Joints”, IBM Journal, Research and Development, vol. 23, No. 2, 1979.
4. 4. D. Chen, S. Cheng, T. D. Geerhardt, “Thermal Stresses in Laminated Beams”, J. Thermal Stresses, vol. 5, 1982.
5. 5. F.-V. Chang, “Thermal Contact Stresses of Bi-Metal Strip Thermostat”, Applied Mathematics and Mechanics, vol. 4, No. 3, Tsing-hua Univ., Beijing, China, 1983.
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