Stresses and strains in a plate bonded to a substrate: Semiconductor devices
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Thermally-induced cracking in the fabrication of semiconductor devices
2. Residual Thermoelastic Stresses in Bonded Silicon Wafers
3. Thermal Stresses in a Rectangular Plate Clamped Along an Edge
4. Stresses in Epitaxially Grown Single‐Crystal Films: YIG on YAG
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