Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Strategies for improving the reliability of solder joints on power semiconductor devices;Lu;Solder.Surf.Mt. Technol.,2004
2. Double-bump surface-mount technology for very high IO interconnections;Frank,1988
3. Reliability performance of stretch solder interconnections;Lim,2006
4. Stresses in cemented joints;Goland;ASME J. Appl. Mech.,1944
5. Thermal stress and fracture in shear-constrained semiconductor device structures;Taylor;IRE Trans. Electron Devices,1962