Determination of Friction Coefficient of a Press-Fit Pin in Thin Plating
Author:
Affiliation:
1. Department of Nanomechanics, Tohoku University
2. Keihin Corporation
3. Institute of Fluid Science, Tohoku University
Publisher
Japan Society of Mechanical Engineers
Subject
Mechanical Engineering,General Materials Science
Link
http://www.jstage.jst.go.jp/article/jsmea/49/3/49_3_363/_pdf
Reference13 articles.
1. The Impact of Lead-Free Legislation Exemptions on the Electronics Industry
2. Mechanism of electrical conduction through anisotropically conductive adhesive films
3. Behaviour of anisotropic conductive joints under mechanical loading
4. Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
5. Solderless Press-Fit Interconnections: A Mechanical Study of Solid and Compliant Contacts
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3. Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices;Journal of Electronic Packaging;2012-07-18
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