Non-Destructive Inspection System for Bump Joints in Area-Arrayed Flip Chip Packaging Structures(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)-Reference-Cited by-同舟云学术

Non-Destructive Inspection System for Bump Joints in Area-Arrayed Flip Chip Packaging Structures(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

Published:2009 Issue:755 Volume:75 Page:823-830
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

SATO Yuki¹,MIURA Hideo¹

Affiliation:

1. Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia1979/75/755/75_KJ00005652773/_pdf

Reference27 articles.

1. 1) ZAMA S. IEEE Transactions on Electronics Packaging Manufacturing. (2001) vol.24, no.4, p.261-268.

2. 2) LIN T. IEEE Transactions on Electronics Packaging Manufacturing. (2007) vol.30, no.3, p.206-212.

3. 3) TANAKA N. Transactions on ASME, Journal of Electronic Packaging. (2004) vol.126, p.2-86.

4. 4) TOMITA Y. Journal of Japan Institute of Electronics Packaging. (2003) vol.6, no.1, p.48-55.

5. 5) TERAMOTO A. IEEE Transactions on Electronics Packaging Manufacturing. (2007) vol.30, no.4, p.285-292.

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