Feasibilities on Ultrasonic Flip-Chip Bonding in 20 .MU.m-pitch for COC Structure.-Reference-Cited by-同舟云学术

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Feasibilities on Ultrasonic Flip-Chip Bonding in 20 .MU.m-pitch for COC Structure.

Published:2003 Issue:1 Volume:6 Page:48-55
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

TOMITA Yoshihiro,KAJIWARA Ryoichi,MORIFUJI Tadahiro,TAKAHASHI Kenji,BONKOHARA Manabu

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep1998/6/1/6_1_48/_pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Non-Destructive Inspection System for Bump Joints in Area-Arrayed Flip Chip Packaging Structures(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering);TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2009

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