Evaluation of Interfacial Strength of Copper Thin Film on Printed Circuit Board with Micro Cutting System-Reference-Cited by-同舟云学术

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Evaluation of Interfacial Strength of Copper Thin Film on Printed Circuit Board with Micro Cutting System

Published:2011 Issue:778 Volume:77 Page:970-979
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

OMIYA Masaki¹,NISHIYAMA Ituo

Affiliation:

1. Keio Univ. Dept. of Mechanical Engineering

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.jstage.jst.go.jp/article/kikaia/77/778/77_778_970/_pdf

Reference15 articles.

1. (1) 結城良治,界面の力学,(1993), 培風館.

2. (2) 中佐啓二郎,"界面強度評価法の現状と問題点(界面強度評価小委員会中間報告)",日本材料学会破壊力学部門第13回破壊力学シンポジウム講演論文集 (2007), pp.82-86.

3. (3) Omiya, M., Inoue, H. and Kishimoto, K., “Evaluation of Interfacial Strength by Multi-stages Peel Test”, Key Engineering Materials, Vol.261-263, (2004), pp.483-488.

4. Evaluation of Interfacial Adhesion Strength between Brittle Thin Film and Polymer Substrate

5. (5) 西山逸雄,"塗膜付着強度.せん断強度測定装置",特許公開2003-254894.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method;Circuit World;2014-04-29

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