Evaluation of Interfacial Adhesion Strength between Brittle Thin Film and Polymer Substrate-Reference-Cited by-同舟云学术

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Evaluation of Interfacial Adhesion Strength between Brittle Thin Film and Polymer Substrate

Published:2004 Issue:8 Volume:53 Page:856-861
ISSN:1880-7488
Container-title:Journal of the Society of Materials Science, Japan
language:
Short-container-title:Journal of the Society of Materials Science, Japan

Author:

OMIYA Masaki,INOUE Hirotsugu,KISHIMOTO Kikuo,YANAKA Masaaki,IHASHI Noritaka

Publisher

Society of Materials Science, Japan

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Interfacial Strength of Copper Thin Film on Printed Circuit Board with Micro Cutting System;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2011

2. Evaluation on Interfacial Strength of Polyimide Film/Si Substrate Structure by Nanoindentation Method;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2010

3. Enhanced bending stability of carbon-nanotube-reinforced indium tin oxide films on flexible plastic substrates;Applied Physics Letters;2008-07-07

4. Mechanism of Damage Process on Si3N4/Cu Interface in Nanoscratch Test;Journal of Solid Mechanics and Materials Engineering;2007

5. Interfacial Strength of Ceramic Thin Film on Polymer Substrate;Fracture of Nano and Engineering Materials and Structures

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