Analysis of Strain with Chemical Reaction During Warp Deformation for Viscoelastic Laminated Beam Consisted with Thermosetting Resin and Steel-Reference-Cited by-同舟云学术

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Analysis of Strain with Chemical Reaction During Warp Deformation for Viscoelastic Laminated Beam Consisted with Thermosetting Resin and Steel

Published:2010 Issue:768 Volume:76 Page:1009-1016
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

NAKAMURA Shozo¹,TANAKA Takaaki,KIMURA Kento

Affiliation:

1. Department of Intelligent Mechanical Engineering, Hiroshima Institute of Technology

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia1979/76/768/76_KJ00006538157/_pdf

Reference18 articles.

1. 1) MATSUI H. Viscoelastic Properties of Thermosetting Resin in Phase Transition and Effect of Curing Temperature on Internal Stress. JSME. (1996) vol.62, no.596,

2. 2) JINNO M. Internal Strain Monitoring by Optical Fiber Sensor and Cure Shrinkage During Curing of CFRP. JSMS. (2003) vol.52, no.6, p.668-694.

3. 3) MIYAKE K. Thermo-Viscoelastic Analysis for Warpage of Ball Grid Array Package Taking into Consideration of Chemical Shrinkage of Molding Compound. JIEP. (2004) vol.7, no.1, p.54-59.

4. Analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulator

5. Development of Resin Strress Buffer Layer Type Wafer Level Chip Size Package with High Reliability for Board Level Test

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bibliography;Polymeric Materials for Electronic Packaging;2023-08-31

2. Prediction of warp deformation for four-layer laminated structure containing resin by thermal load;Transactions of the JSME (in Japanese);2016

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