Analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulator
Author:
Affiliation:
1. Graduate School of Natural Science & Technology, Kanazawa Univ.
2. TDK Co., Ltd.
Publisher
The Japan Society of Polymer Processing
Link
https://www.jstage.jst.go.jp/article/seikeikakou1989/18/10/18_10_752/_pdf
Reference2 articles.
1. 1) Taketani, N., Hatano, K., Sugimoto, H., Yoshioka, O., and Murakami, G.: ISHM, Proceeding, 594 (1996)
2. 13) Koo, H. S., Park, S. J., Kim, W. B., Kim, C. M., Ha, Y. K. and Kim, Y. S.: Presented at ANTEC 2000, Orland, USA (2000)
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Analysis of Strain with Chemical Reaction During Warp Deformation for Viscoelastic Laminated Beam Consisted with Thermosetting Resin and Steel;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2010
2. Warp Deformation Behavior with Chemical Curing Process for Viscoelastic Laminated Beam Composed of Epoxy Resin and Steel;Journal of the Society of Materials Science, Japan;2007
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