Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures-Reference-Cited by-同舟云学术

Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

Published:2016 Issue:3 Volume:3 Page:16-00081-16-00081
ISSN:2187-9745
Container-title:Mechanical Engineering Journal
language:en
Short-container-title:

Author:

HIYOSHI Noritake¹

Affiliation:

1. Department of Mechanical Engineering, University of Fukui

Publisher

Japan Society of Mechanical Engineers

Subject

General Medicine

Link

https://www.jstage.jst.go.jp/article/mej/3/3/3_16-00081/_pdf

Reference24 articles.

1. Chen, X., Song, J., and Kim, K. S., Low cycle fatigue life prediction of 63Sn-37Pb solder under proportional and non-proportional loading, International Journal of Fatigue, Vol.28, Issue 7 (2006), pp.757-766.

2. Fakpan, K., Otsuka, Y., Mutoh, Y., Inoue, S., Nagata, K. and Kodani, K., Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures, Procedia Engineering, Vol.10 (2011), pp.1238-243.

3. Hiyoshi, N., Katoh, A., Sakane, M. and Tsukada, Y, Low Cycle Fatigue Lives of Sn-37Pb and Sn-3.5Ag Solders at Low Temperatures, Journal of the Society of Materials Science, Japan, Vol.58, No.2 (2009), pp.155-161 (in Japanese).

4. Mahmudi, R., Rezaee-Bazzaz, A. and Banaie-Fard, H.R., Investigation of stress exponent in the room-temperature creep of Sn-40Pb-2.5Sb solder alloy, Journal of Alloys and Compounds, Vol.429 (2007), pp.192-197.

5. Nozaki, M., Sakane, M., Tsukada, Y. and Nishimura, H., Creep-Fatigue Life Evaluation of Sn-3.5Ag Solder, Proceedings of the 39th Symposium on Strength of Materials at High Temperatures (2001), pp.131-135 (in Japanese).

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