Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference9 articles.
1. Low-cycle fatigue properties of eutectic solders at high temperatures
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1. Short Term Transversally Isotropic Creep of Plates Under Static and Periodic Loading;Advances in Mechanics of High-Temperature Materials;2019-07-10
2. Microstructure and Welding Performance of Sn–Ag–Cu Material;Lecture Notes in Mechanical Engineering;2018
3. Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue;Acta Metallurgica Sinica (English Letters);2017-07-26
4. Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures;Mechanical Engineering Journal;2016
5. Effect of Strain Rate and Temperature on Micro Fatigue Crack Propagation of Bi-Sn Eutectic Alloy;MATERIALS TRANSACTIONS;2016
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