Direct Laser Drilling in Copper Clad Printed Wiring Boards : Visualization of Removal Process Based on High-Speed Camera Images(Machine Elements, Design and Manufacturing)-Reference-Cited by-同舟云学术

Direct Laser Drilling in Copper Clad Printed Wiring Boards : Visualization of Removal Process Based on High-Speed Camera Images(Machine Elements, Design and Manufacturing)

Published:2010 Issue:771 Volume:76 Page:3143-3149
ISSN:0387-5024
Container-title:Transactions of the Japan Society of Mechanical Engineers Series C
language:en
Short-container-title:Trans.JSME(C)

Author:

HIROGAKI Toshiki¹,AOYAMA Eiichi¹,OGAWA Keiji,AYUZAWA Tsukasa

Affiliation:

1. Department of Mechanical Engineering, Doshisha University

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

Link

https://www.jstage.jst.go.jp/article/kikaic1979/76/771/76_KJ00006856933/_pdf

Reference8 articles.

1. 1) BURGESS L. W. Blind microvia technology by laser. National Electronic Packaging and Production Conference Proceedings of the Technical Program, 1999. (1999) p.1765-1772.

2. 2) The Japan Society of Mechanical Engineers. Heat Transfer Engineering Data. (1997) p.314-321.

3. 3) Showa Denko K. K. HIGILITE catalog. Showa Denko K. K.. (2009) p.1-2.

4. 4) OWEN M. Circuit World. (1997) vol.24, no.1, p.45-49.

5. 5) ARAI K. PWB production technology-PWB production state of art trend judging from history-new CO_2-Cu direct processing method. Japan Institute of Electronics Packaging. (2001) vol.17, no.6, p.38-43.

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