Optimization of Step Micro Drilling Motion with High Speed and Short Stroke in Printed Wiring Boards by Response Surface Method-Reference-Cited by-同舟云学术

Optimization of Step Micro Drilling Motion with High Speed and Short Stroke in Printed Wiring Boards by Response Surface Method

Published:2012 Issue:788 Volume:78 Page:1280-1294
ISSN:0387-5024
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
language:en
Short-container-title:Trans.JSME(C)

Author:

HIROGAKI Toshiki¹,AOYAMA Eiichi¹

Affiliation:

1. Doshisha Univ. Dept. of Mechanical Engineering

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

Link

https://www.jstage.jst.go.jp/article/kikaic/78/788/78_788_1280/_pdf

Reference11 articles.

1. Microdrilling for printed circuit boards (PCBs)—Influence of radial run-out of microdrills on hole quality

2. Study on Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB and Optimum Drilling Condition

3. (3) E. Aoyama, T. Hirogaki, K. Ogawa, S. Nojiri, Y. Takeda, “Effect of Rapid-Feed Step-Drilling Cycle and Super-High-Speed Spindle for High-Speed Micro Drilling in Printed Wiring Boards”, Trans Tech Publications, Key Engineering Materials Vols. 447-448,(2010), pp.836-840.

4. (5) R.Venkatraman, K. Ramakrishna, K. Knadle, W. T. Chen, G. C. Haddon, “Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards”, ASME, Journal of Electron Package, Vol.123, MARCH (2001), pp.6-15.

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