Effects of Support and Heat Dissipation in Thermal Stress Cleaving of Thin Glass Plates
Author:
Affiliation:
1. Department of Mechanical Systems Engineering, Nagasaki University
Publisher
Japan Society of Mechanical Engineers
Link
http://www.jstage.jst.go.jp/article/jmmp/3/3/3_3_529/_pdf
Reference10 articles.
1. 1) Home Page of CEATEC JAPAN, URL; http://www.ceatec.com.
2. 2) Yasufumi IMAI, Hideki MORITA, Tooru TAKASE, and Hiroyuki KOGA, Possibility of Employing Thermal Stresses as a Cutting Device for Brittle Materials, Journal of Japan Society of Mechanical Engineers, A55-509, 147 (1989).
3. 3) Hideki MORITA, and Yasufumi IMAI, Crack Extension Induced by Thermal Stresses Associated with Uniform Heating in a Circle, Journal of Japan Society of Mechanical Engineers, A56-524, 850 (1990).
4. 4) Yasufumi IMAI, Hideki MORITA and Tooru TAKASE, Stress Intensity Factor for a Semi-infinite Crack Heated by a Moving Source of Heat, Journal of Japan Society of Mechanical Engineers, A56-524, 855 (1990).
5. 5) Yasufumi IMAI, Katsuhisa HIRATA and Toru TAKASE, Crack Tip Opening due to Crack-face Heating in an Infinite Plate, Journal of Japan Society of Mechanical Engineers, A57-544, 2897 (1991).
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