Author:
Choi Sungho,Jhang Kyung-Young
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. R. M. Lumley, Controlled separation of brittle materials using a laser, American Ceramic Society Bulletin, 48 (1) (1969) 850–854.
2. C. H. Tsai and C. S. Liou, Fracture mechanism of laser cutting with controlled fracture, Journal of Manufacturing Science and Engineering, 125 (3) (2003) 519–528.
3. T. Ueda, K. Yamada, K. Oiso and A. Hosokawa, Thermal stress cleaving of brittle materials by laser beam, CIRP Annals Manufacturing Technology, 51 (1) (2002) 149–152.
4. J. Liu, J. Lu, X. Ni, G. Dai and L. Zhang, Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser, Chinese Optics Letters, 8 (10) (2010) 1000–1003.
5. J. Liu, J. Lu, X. Ni, G. Dai, L. Zhang and Y. Chen, Numerical study on thermal stress cutting of silicon wafer using two-point pulsed laser, Optica Applicata, 41 (1) (2011) 247–255.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献