New Optimization Strategy for Chemical Mechanical Polishing Process.-Reference-Cited by-同舟云学术

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New Optimization Strategy for Chemical Mechanical Polishing Process.

Published:2001 Issue:2 Volume:44 Page:534-543
ISSN:1344-7653
Container-title:JSME International Journal Series C
language:en
Short-container-title:JSME Int. J., Ser. C

Author:

WANG Gou-Jen¹,CHEN Jau-Liang¹,HWANG Ju-Yi¹

Affiliation:

1. Department of Mechanical Engineering, National Chung-Hsing University

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/jsmec/44/2/44_2_534/_pdf

Reference13 articles.

1. (2) The National Technology Roadmap for Semiconductors, (1994), Semiconductor Industry Association, San Jose, CA.

2. Parametric properties of the transportation problem and relations to supermatroids

3. (4) Maury, A., et al., Optimization of CMP Process for TEOS Based Oxide Films Using a Designed Experiment, CMP-MIC Proc., (1996), pp. 285-290.

4. (5) Zheng, J.Z., et al., Optimization of Pad Conditioning for Stable Oxide CMP Process, CMP-MIC Proc., (1997), pp. 315-321.

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2. Optimization of the Polishing Parameters for the Glass Substrate of STN-LCD;Materials and Manufacturing Processes;2008-10-30

3. Experimental dynamics characterization and monitoring of MRR in oxide chemical mechanical planarization (CMP) process;International Journal of Machine Tools and Manufacture;2008-10

4. Adaptive Neuro-Fuzzy Inference System Modeling of MRR and WIWNU in CMP Process With Sparse Experimental Data;IEEE Transactions on Automation Science and Engineering;2008-01

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