Affiliation:
1. Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong
Abstract
A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8]
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
17 articles.
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