Modern Solder Technology for Competitive Electronics Manufacturing-Reference-Cited by-同舟云学术

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Modern Solder Technology for Competitive Electronics Manufacturing

Published:1997-09-01 Issue:3 Volume:119 Page:214-215
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Hwang Jennie S.,Rafanelli Anthony J.¹

Affiliation:

1. Raytheon Electronic Systems, Portsmouth, RI

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/3/214/5801525/214_1.pdf

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Porous Membrane‐Enabled Fast Liquid Metal Patterning in Thin Blind‐Ended Microchannels;Advanced Materials Technologies;2019-07-05

3. Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue;Microelectronics Reliability;2010-01

4. Predictive Analytical Thermal Stress Modeling in Electronics and Photonics;Applied Mechanics Reviews;2009-06-04

5. Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes;Materials Science Forum;2007-09

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