1. Tengblad
N.
and PalmB., 1996, External two phase thermosiphons for cooling of electronic components, International Journal of Microcircuits and Electronic Packaging, 19 (1), 22–29.
2. Palm
B.
and TengbladN., 1996, Cooling of electronics by heat pipes and thermosyphons - A review of methods and possibilities, National Heat Transfer Conference, HTD-Vol 329, Volume 7, 97–108.
3. Ramaswamy
C.
, JoshiY., NakayamaW. and JohnsonW. B., 1998, Performance of a compact two-phase thermosyphon: Effect of evaporator inclination, liquid fill volume and contact resistance, Proceedings of the 11th International Heat Transfer Conference, Vol. 2, Kyongju, Korea, 127–132.
4. Ramaswamy
C.
, JoshiY., NakayamaW. and JohnsonW. B., 1999, Compact thermosyphons employing microfabricated components, Microscale Thermophysical Engineering, 3, 273–282.
5. Ramaswamy
C.
, JoshiY., NakayamaW. and JohnsonW. B., 1999, Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads, Journal of Enhanced Heat Transfer, 6, 279–288.