Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints-Reference-Cited by-同舟云学术

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Published:2006-01-01 Issue: Volume: Page:
ISSN:
Container-title:Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
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Author:

Abdulhamid Mohd F.¹,Basaran Cemal¹,Hopkins Douglas C.¹

Affiliation:

1. State University of New York at Buffalo

Abstract

The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

Publisher

ASMEDC

Link

http://asmedigitalcollection.asme.org/IMECE/proceedings-pdf/doi/10.1115/IMECE2006-13119/2781928/53_1.pdf

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