Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design
Author:
Affiliation:
1. Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602 e-mail:
2. Professor Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602 e-mail:
Abstract
Funder
Air Force Office of Scientific Research
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4040552/6367823/ep_140_04_041001.pdf
Reference36 articles.
1. Flexible Electronics Under Strain: A Review of Mechanical Characterization and Durability Enhancement Strategies;J. Mater. Sci.,2016
2. Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling;ASME J. Electron. Packag.,2016
3. Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors;ASME J. Electron. Packag.,2007
4. Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages;ASME J. Electron. Packag.,2015
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