FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion-Reference-Cited by-同舟云学术

FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion

Published:2023-12 Issue:12 Volume:13 Page:1885-1896
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wang Dian¹,Sheng Jiazheng²,Li Hui³^ORCID,Zhang Yikai¹,Sun Bin⁴,Wang Jian⁴

Affiliation:

1. Institute of Technological Sciences, Wuhan University, Wuhan, China

2. School of Power and Mechanical Engineering, Wuhan University, Wuhan, China

3. School of Power and Mechanical Engineering and the Institute of Technological Sciences, Wuhan University, Wuhan, China

4. Jiangsu Leader-Tech Semiconductor Company Ltd., Pizhou, China

Funder

Shenzhen Fundamental Research Program

Guangdong Basic and Applied Basic Research Foundation

Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration

Wuhan East Lake District Unveiling the List of Hanging Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference44 articles.