Recent Developments in Gradient Plasticity—Part I: Formulation and Size Effects

Author:

Tsagrakis Ioannis1,Aifantis Elias C.23

Affiliation:

1. Laboratory of Mechanics and Materials (LMM), Polytechnic School, Aristotle University of Thessaloniki, Thessaloniki, GR-54006 Greece

2. Laboratory of Mechanics and Materials (LMM), Polytechnic School, Aristotle University of Thessaloniki, Thessaloniki, GR-54006 Greece

3. Center for the Mechanics of Material Instabilities and Manufacturing Processes (MMINMP), Michigan Tech, Houghton, MI 49931

Abstract

The purpose of this two-part article, is first to give an update of recent developments of gradient plasticity as this was advanced by Aifantis and co-workers in the early eighties to address dislocation patterning and shear band problems, and then to elaborate on two specific issues of current interest: size effects and plastic heterogeneity. In Part I, a brief review of gradient dislocation dynamics as providing a direct motivation for the simplest form of gradient plasticity is given. Then, a more general phenomenological formulation of gradient plasticity is given and used to interpret size effects. In Part II, wavelet analysis is used as a potential tool to describe plastic heterogeneity at very fine scales for which experimental results are not available, as well as for providing another means to interpret size effects through the derivation of scale-dependent constitutive equations.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 52 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3