Thermomechanical Durability of High I/O BGA Packages

Author:

Davuluri P.1,Shetty S.1,Dasgupta A.1,Young S.2

Affiliation:

1. CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

2. General Dynamics Information Systems, MN 55431

Abstract

Efficient modeling strategies are developed to study thermomechanical durability of high I/O Ball Grid Array (BGA) packages, in order to facilitate virtual qualification and accelerated testing of component designs. A viscoplastic stress analysis technique is developed where the critical solder joint(s) (joint(s) where failure first occurs) are modeled in detail with a multi-domain Rayleigh-Ritz (MDRR) methodology while the load-sharing offered by noncritical joints is modeled with a simplified compact model. This hybrid technique is used to study the behavior of solder interconnects in selected Ball Grid Array (BGA) package under thermal cycling environments. Parametric studies are conducted to determine the optimal scheme for allocating a critical number of solder joints to the MDRR model, and the remaining non-critical joints to the compact models. Damage calculations are made with the Energy Partitioning Solder Durability model and cycles-to-failure predictions are compared with both finite element model predictions as well as experimental failure data provided by CALCE EPSC sponsors. Parametric studies on change in solder joint durability with interconnect volume are also discussed in this paper.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Lau, J. H., and Lee, R., 1997, “Solder Joint Reliability of Plastic Ball Grid Array with Solder Bumped Flip Chip,” American Society of Mechanical Engineers (Paper) Nov. 16–21, ASME 0402-1215.

2. Gustafsson, G., et al., 2000, “Finite Element Modeling of BGA Packages for Life Prediction,” Proceedings of Electronic Components and Technology Conference, May, pp. 1059–1063.

3. Darveaux, R., 1997, “Solder Joint Fatigue Life Model,” Proceedings TMS Annual Meeting, Feb., pp. 213–218.

4. Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proceedings of Electronic Components and Technology Conference, May, pp. 1048–1058.

5. Ling, S., and Dasgupta, A., 1996, “A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints,” ASME J. Electron. Packag., 118, pp. 72–79.

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