Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity-Reference-Cited by-同舟云学术

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Published:1998-06-01 Issue:2 Volume:120 Page:145-149
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Qian Z.¹,Lu M.¹,Liu S.¹

Affiliation:

1. Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202

Abstract

A unified constitutive model for polymer films is proposed with viscoelastic characterization at small deformation and viscoplastic characterization at large deformation based on molecular chain deformation mechanisms. The evolution equations and the temperature dependence of drag stress and back stress are established from molecular network theories in this paper. The material constants are then determined by master curves and a consistent procedure. A good agreement between the experimental data of polycarbonate film tests and model predictions is achieved.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/120/2/145/5565140/145_1.pdf

Reference31 articles.

1. Argon A. S. , 1973, “A Theory for the Low-Temperature Plastic Deformation of Glassy Polymers,” Phil. Mag., Vol. 28, pp. 839–865.

2. Boyce M. C. , MontagutE. L., and ArgonA. S., 1992, “The Effects of Thermomechanical Coupling on the Cold Drawing Process of Glassy Polymers,” Poly. Eng. Sci., Vol. 32, pp. 1073–1085.

3. Boyce M. C. , ArrudaE. M., and JayachandranR., 1994, “The Large Strain Compression, Tension, and Simple Shear of Polycarbonate,” Poly. Eng. Sci., Vol. 34, pp. 716–725.

4. Buisson G. , and Ravi-ChandarK., 1990, “On the Constitutive Behavior of Polycarbonate Under Large Deformation,” Polymer, Vol. 31, pp. 2071–2076.

5. Carmak M. , and LeeS. W., 1995, “Molecular Mechanism of Neck Formation in Uniaxial Stretched Poly(ethylene naphthalate) Films,” Polymer, Vol. 36, pp. 4039–4054.

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