An Investigation of Material Removal Mechanisms in Lapping with Grain Size Transition

Author:

Chang Y. P.1,Hashimura M.2,Dornfeld D. A.3

Affiliation:

1. IBM, San Jose, CA 95113

2. Nippon Steel Corp., Sapporo, Japan

3. Dept. of Mechanical Engineering, University of California, Berkeley, Berkeley, CA 94720

Abstract

The mechanical material removal (MRR) mechanisms in lapping were investigated, using concepts of two-body vs. three-body abrasion and ductile vs. brittle machining. The statistical nature of the depth of cut in the lapping process was described using distribution of abrasive sizes in the slurry. Through the change in abrasive size distribution, the time dependent characteristic of MRR was captured in the model. Experiments were conducted for model verification. It was found that a constant 60 deg effective inclusion angle allowed the model to fit measurement well. [S1087-1357(00)00504-9]

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference19 articles.

Cited by 50 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Modelling and simulation of MRR in electro-chemical surface grinding of Al-SiC-Gr using hybrid analytical approach;Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering;2023-11-29

2. Super hard and brittle material removal mechanism in fixed abrasive lapping: Theory and modeling;Tribology International;2023-06

3. Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing;Applied Surface Science;2022-10

4. Grinding and Lapping Induced Surface Integrity of Silicon Wafers and its Effect on Chemical Mechanical Polishing;SSRN Electronic Journal;2022

5. Ultra-precision manufacturing of silicon carbide mirrors with additive manufacturing;10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced and Extreme Micro-Nano Manufacturing Technologies;2021-12-13

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3